Mikata Co., Ltd. Resin Molding Processing Technology Introduction
The pursuit is "high precision" and "processing that does not stress the material."
At Mikata Co., Ltd., we propose a resin cutting process that allows for stress-free extraction of resin films. When processing adhesive materials and wrapping them, there can be adhesive overflow from the side of the adhesive material (cut surface) as it approaches the paper tube (core) section. However, our company has successfully implemented a wrapping technique to prevent this overflow. With this stress-free method, we have achieved minimal adhesive overflow and a cross-section with almost no burrs during the cutting process. 【Features】 ■ Almost no adhesive overflow occurs during the cutting process with our stress-free method. ■ Achieves a cross-section with almost no burrs. *For more details, please contact us or download the catalog.
- Company：美方
- Price：Other
